주제분류(KDC/DDC) |
응용 물리
|
848
|
6
|
|
주제어 |
$O_2$ plasma pre-treatment
|
1
|
1
|
|
Flexible printed circuit boar ...
|
1
|
1
|
|
Interfacial adhesion energy
|
1
|
1
|
|
Screen-printed Ag
|
1
|
1
|
|
channeling crack
|
1
|
1
|
|
chromium plating
|
1
|
1
|
|
electroless nickel
|
1
|
1
|
|
Fan-out wafer level packaging
|
3
|
2
|
|
Redistribution layer
|
2
|
1
|
|
RuAlO
|
2
|
1
|
|
Sympathy to South Korea lit ...
|
2
|
1
|
|
thermal cycle
|
2
|
1
|
|
發音指導
|
2
|
1
|
|
peel test
|
9
|
4
|
|
Double cantilever beam test
|
3
|
1
|
|
Interfacial adhesion
|
3
|
1
|
|
ビリ一フ
|
3
|
1
|
|
日本語敎師
|
3
|
1
|
|
4-point bending test
|
10
|
3
|
|
Polyimide
|
7
|
2
|
|
cuinterconnect
|
8
|
2
|
|
觀音講
|
4
|
1
|
|
interfacial adhesion energy
|
5
|
1
|
|
microcrack
|
5
|
1
|
|
子安觀音
|
5
|
1
|
|
發音
|
5
|
1
|
|
post-annealing
|
8
|
1
|
|
Printed electronics
|
23
|
1
|
|
cmp
|
28
|
1
|
|
Adhesion
|
81
|
2
|
|
epoxy resin
|
54
|
1
|
|
ald
|
65
|
1
|
|
Reliability
|
966
|
1
|
|
계 |
|
2,163 |
48 |
|
* 주제로 분류 되지 않은 논문건수 |
|
0 |
|