주제분류(KDC/DDC) |
응용 물리
|
853
|
6
|
|
주제어 |
Electronic system
|
1
|
1
|
|
Interfacial adhesion energy
|
1
|
1
|
|
Metal micro-wire
|
1
|
1
|
|
Submillimeter diameter
|
1
|
1
|
|
UV curing system
|
1
|
1
|
|
electroplated copper
|
1
|
1
|
|
lamination layer
|
1
|
1
|
|
solder resist
|
1
|
1
|
|
3-point bending
|
2
|
1
|
|
Measurement technology
|
2
|
1
|
|
Steerable catheter
|
2
|
1
|
|
Through-Silicon-Via
|
2
|
1
|
|
Coefficient of Thermal Expa ...
|
3
|
1
|
|
Double cantilever beam test
|
3
|
1
|
|
Electronic packaging
|
3
|
1
|
|
Fan-out wafer level packaging
|
3
|
1
|
|
The curse of the Japanese la ...
|
4
|
1
|
|
Zainichi Koreans Literature
|
4
|
1
|
|
flexuralmodulus
|
4
|
1
|
|
wiring
|
4
|
1
|
|
복대리
|
4
|
1
|
|
ニヒリズム
|
5
|
1
|
|
민족적 주체성
|
6
|
1
|
|
peel test
|
9
|
1
|
|
4-point bending test
|
10
|
1
|
|
prepreg
|
10
|
1
|
|
pb-free
|
11
|
1
|
|
歷史
|
11
|
1
|
|
自由
|
15
|
1
|
|
夢
|
20
|
1
|
|
Stretchable electronics
|
23
|
1
|
|
記憶
|
35
|
1
|
|
Flexible electronics
|
36
|
1
|
|
Polymer
|
123
|
1
|
|
Fracture
|
142
|
1
|
|
Thermal conductivity
|
178
|
1
|
|
Mechanical properties
|
304
|
1
|
|
Reliability
|
1,010
|
2
|
|
graphene
|
480
|
1
|
|
계 |
|
3,329 |
46 |
|
* 주제로 분류 되지 않은 논문건수 |
|
0 |
|