주제분류(KDC/DDC) |
응용 물리
|
848
|
5
|
|
주제어 |
lowalpha
|
1
|
1
|
|
nano-reinforced solder
|
1
|
1
|
|
solder bumping
|
1
|
1
|
|
three dimensional packaging
|
1
|
1
|
|
transient liquid phase (TLP ...
|
1
|
1
|
|
solderability
|
2
|
1
|
|
tsv (through silicon via)
|
2
|
1
|
|
brazing
|
3
|
1
|
|
wetting balance test
|
3
|
1
|
|
High temperature operation
|
4
|
1
|
|
cufilling
|
4
|
1
|
|
power semiconductor
|
4
|
1
|
|
dissimilarmaterials
|
5
|
1
|
|
joining
|
8
|
1
|
|
intermetallic compound
|
10
|
1
|
|
lead-free
|
11
|
1
|
|
welding
|
11
|
1
|
|
pb-free solder
|
12
|
1
|
|
soldering
|
12
|
1
|
|
power module
|
13
|
1
|
|
surface tension
|
14
|
1
|
|
miniaturization
|
18
|
1
|
|
wettability
|
28
|
1
|
|
aluminum
|
57
|
1
|
|
mechanical properties
|
415
|
1
|
|
계 |
|
1,489 |
30 |
|
* 주제로 분류 되지 않은 논문건수 |
|
0 |
|