주제분류(KDC/DDC) |
응용 물리
|
848
|
10
|
|
주제어 |
automotive power device packa ...
|
1
|
1
|
|
complexing agents
|
1
|
1
|
|
lead-freebonding
|
1
|
1
|
|
mcirostructure
|
1
|
1
|
|
nano-reinforced solder
|
1
|
1
|
|
transient liquid phase (TLP ...
|
1
|
1
|
|
3dpackating
|
2
|
1
|
|
activemetalbrazing
|
2
|
1
|
|
bondingmechanism
|
2
|
1
|
|
figure of merit(zt)
|
2
|
1
|
|
solderability
|
2
|
1
|
|
brazing
|
3
|
1
|
|
differential pressure
|
3
|
1
|
|
wetting balance test
|
3
|
1
|
|
High temperature operation
|
4
|
1
|
|
TLP bonding
|
4
|
1
|
|
Watanabe Shinpo
|
4
|
1
|
|
cufilling
|
4
|
1
|
|
power semiconductor
|
4
|
1
|
|
이과적 사고
|
4
|
1
|
|
항공지식의 함양
|
4
|
1
|
|
활공교육
|
4
|
1
|
|
Electroless
|
5
|
1
|
|
dissimilarmaterials
|
5
|
1
|
|
power module
|
13
|
2
|
|
모형비행기
|
7
|
1
|
|
Seebeck effect
|
8
|
1
|
|
joining
|
8
|
1
|
|
intermetallic compound
|
10
|
1
|
|
lead-free
|
11
|
1
|
|
pb-free
|
11
|
1
|
|
welding
|
11
|
1
|
|
pb-free solder
|
12
|
1
|
|
soldering
|
12
|
1
|
|
through silicon via
|
12
|
1
|
|
plating
|
14
|
1
|
|
power semiconductor
|
14
|
1
|
|
surface tension
|
14
|
1
|
|
ag paste
|
17
|
1
|
|
miniaturization
|
18
|
1
|
|
power generation
|
19
|
1
|
|
wettability
|
28
|
1
|
|
additives
|
30
|
1
|
|
copper
|
33
|
1
|
|
nanotechnology
|
39
|
1
|
|
packaging
|
38
|
1
|
|
thermoelectric
|
48
|
1
|
|
shear strength
|
50
|
1
|
|
aluminum
|
57
|
1
|
|
residual stress
|
56
|
1
|
|
additive
|
67
|
1
|
|
wettability
|
71
|
1
|
|
electrodeposition
|
89
|
1
|
|
energy
|
93
|
1
|
|
ceramics
|
106
|
1
|
|
mems
|
109
|
1
|
|
sensor
|
237
|
1
|
|
mechanical properties
|
415
|
1
|
|
temperature
|
511
|
1
|
|
계 |
|
3,203 |
70 |
|
* 주제로 분류 되지 않은 논문건수 |
|
0 |
|