연구동향 분석

TSV 인터포저 기술을 이용한 3D 패키지의 방열 해석

서일웅 이미경 김주현 좌성훈 Suh, Il-Woong Lee, Mi-Kyoung Kim, Ju-Hyun Choa, Sung-Hoon 2014년

논문상세정보
인용/피인용
' TSV 인터포저 기술을 이용한 3D 패키지의 방열 해석' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • system in package
  • thermal analysis
  • through-siliconviainterposer
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
74 0

0.0%

' TSV 인터포저 기술을 이용한 3D 패키지의 방열 해석' 의 참고문헌

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