The Electrochemical Migration Phenomenon of the Ni-Cr Seed Layer of Sputtered FCCL

Woo-young Ahn Joong soon Jang 2014년

논문상세정보

인용/피인용

논문영향력 요약
동일주제 총논문수	논문피인용 총횟수	주제별 논문영향력의 평균
주제	금속제조 및 가공업 circuitshort electrochemicalmigration ionmigration nicrseedlayer sputteredfccl
424	0	0.0%

논문영향력
주제		주제별 논문수	주제별 논문영향력
주제분류(KDC/DDC)	금속제조 및 가공업	413	0.0%
주제어	circuitshort	1	0.0%
	electrochemicalmigration	1	0.0%
	ionmigration	7	0.0%
	nicrseedlayer	1	0.0%
	sputteredfccl	1	0.0%
계		424	0.0%
* 다른 주제어 보유 논문에서 피인용된 횟수

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