연구동향 분석

3D 패키징을 위한 Scallop-free TSV와 Cu Pillar 및 하이브리드 본딩

장예진 정재필 2022년

논문상세정보
인용/피인용
' 3D 패키징을 위한 Scallop-free TSV와 Cu Pillar 및 하이브리드 본딩' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • Scallop-free
  • Three dimensional packaging
  • Through-Si-Via (TSV)
  • cubonding
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
13 0

0.0%

' 3D 패키징을 위한 Scallop-free TSV와 Cu Pillar 및 하이브리드 본딩' 의 참고문헌

  • 수치해석을 이용한 구리기둥 범프 플립칩 패키지의 열압착 접합 공정 시 발생하는 휨 연구
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    G. H. Wong [2014]
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    H. Liu [2016]
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