연구동향 분석

논시안 금도금층의 조직과 경도에 미치는 Tl+ 과 Pd2+ 이온첨가의 영향

허원영 손인준 2022년

논문상세정보
인용/피인용
' 논시안 금도금층의 조직과 경도에 미치는 Tl+ 과 Pd2+ 이온첨가의 영향' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • Gold sulfite
  • Palladium.
  • Thallium
  • electroplating
  • gold
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
91 0

0.0%

' 논시안 금도금층의 조직과 경도에 미치는 Tl+ 과 Pd2+ 이온첨가의 영향' 의 참고문헌

  • 순도에 따른 Al 판재의 재결정 거동
    이현우 [2016]
  • The orientations of crystals in electrodeposited metals
  • The influence of internal stress on the structure of electro-deposits
  • The effect of thallium on palladium electrodeposition from ethylenediamine-palladium(Ⅱ) complex solutions
    C. Shin [1988]
  • The effect of arsenic on the electrodeposition of palladium from ethylenediamin-palladium(Ⅱ) complex solutions
    Y. Shunichi [1985]
  • The effect of Tl(I)on the hard gold alloy electrodeposition of Au-Co from acid baths
    M. Hosseini [2010]
  • The Au-Pd (gold-palladium) system
    H. Okamoto [1985]
  • Surface morphology and preferred orientation of gold bump layer formed by using Na3[Au(SO3)2]
    I. S. Kim [1995]
  • Study on the electroplating process and crystallographic characteristics for copper interconnect
    H. J. Lee [2003]
  • Stress and microstructure relationships in gold thin films
    B. Kebabi [1990]
  • Statistical analysis on static recrystallization texture evolution in cold-rolled AZ31 magnesium alloy sheet
    J. H. Park [2013]
  • Recrystallization and grain growth of cold-rolled gold sheet
    J. H. Cho [2005]
  • On the theory of normal and abnormal grain growth
    M. Hillert [1965]
  • Modern electroplating
  • Microbump formation by noncyanide gold electroplating
    H. Watanabe [1999]
  • Mechanism of sulfur inclusion in soft gold electrodeposited from the thiosulfate-sulfite bath
    T. Osaka [2001]
  • Grain growth following recrystallization
  • Gold plating technology
    F. H. Reid [1974]
  • Gaval nostatic deposition of palladium-gold alloys in a Lewis basic EMI-Cl-BF[sub 4] ionic liquid
    F. Y. Su [2004]
  • Formation and morophology of electrodeposited Au-Pd alloy films on Cu substrates
    T. Yoshimi [1975]
  • Fabrication of gold bumps using gold sulfite plating
    H. Honma [1995]
  • Elements of X-ray diffraction
  • Electron microscopic investigation on the microstructure and phase of electrodeposited Au-Pd alloys
    S. Yasuo [1976]
  • Effect of electrolysis factors on crystal orientation and morphology of electrodeposited cobalt
    H. Nakano [2002]
  • Effect of Tl-codeposition on Au electrodeposition from non-cyanide bath
    M. Saito [2010]
  • Au-Pd alloy gradients prepared by laterally controlled template synthesis
    T. Sehayek [2006]