연구동향 분석

구리전해도금에서 폴리에틸렌글리콜(polyethylene glycol)의 영향 연구

안의경 최선기 이재원 조성기 2022년

논문상세정보
인용/피인용
' 구리전해도금에서 폴리에틸렌글리콜(polyethylene glycol)의 영향 연구' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • Cu Electrodeposition
  • Polyethylene Glycol
  • Suppressor
  • additive
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
74 0

0.0%

' 구리전해도금에서 폴리에틸렌글리콜(polyethylene glycol)의 영향 연구' 의 참고문헌

  • 구리전해도금에서 알킬아민의 영향 연구
    이재원 [2022]
  • Voltammetric observation of transient catalytic behavior of SPS in copper electrodeposition—its interaction with cuprous ion from comproportionation
    S. K. Cho [2016]
  • The properties of the polyethylene glycol complex PEG(Na+)(Cu+) on the copper electrodeposited layer by time-of-flight secondary-ion mass spectrometry. The new insights
    R. Mroczka [2020]
  • The chemistry of the additives in an acid copper electroplating bath: Part I. Polyethylene glycol and chloride ion
    J. P. Healy [1992]
  • Superconformal film growth: Mechanism and quantification
  • SEIRAS study of chloride-mediated polyether adsorption on Cu
    G. -K. Liu [2018]
  • Role of chloride ions in suppression of copper electrodeposition by polyethylene glycol
  • Revealing the inhibition effect of quaternary ammonium cations on Cu electrodeposition
    Y. E. Jo [2020]
  • Physisorption of poly(ethylene glycol) on inorganic nanoparticles
    Y. Xue [2022]
  • Organic chemistry
    J. McMurry [2016]
  • Ordered anion adlayers on metal electrode surfaces
  • Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths: A surface-enhanced Raman study
    Z. V. Feng [2003]
  • In situ ellipsometric study of PEG⁄Cl- coadsorption on Cu, Ag, and Au
  • Extreme bottom-up superfilling of through-silicon-vias by damascene processing: Suppressor disruption, positive feedback and turing patterns
  • Effect of halides on Cu electrodeposit film : Potential-dependent impurity incorporation
    W. -H. Lee [2017]
  • Copper Electrodeposition for Nanofabrication of Electronics Devices
    M. Yokoi [2014]
  • Chloride ion catalysis of the copper deposition reaction
    Z. Nagy [1995]
  • An Empirical Relation between the Plating Process and Accelerator Coverage in Cu Superfilling
    조성기 [2012]
  • Advances in adsorption of surfactants and their mixtures at solid/solution interfaces
    R. Zhang [2006]