연구동향 분석

무전해 니켈 도금액 pH 변화에 따른 ENIG/Sn-Ag-Cu솔더 접합부의 취성파괴 특성

서원일 이태익 김영호 유세훈 2020년

논문상세정보
인용/피인용
' 무전해 니켈 도금액 pH 변화에 따른 ENIG/Sn-Ag-Cu솔더 접합부의 취성파괴 특성' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • Electroless nickel immersion gold
  • Interfacial intermetallic compound
  • brittle fracture
  • sn-ag-cu
  • solder
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
28 0

0.0%

' 무전해 니켈 도금액 pH 변화에 따른 ENIG/Sn-Ag-Cu솔더 접합부의 취성파괴 특성' 의 참고문헌

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    손윤철 [2005]
  • Reliability study of the electroless Ni-P layer against solder alloy
    M. O. Alam [2002]
  • Pronounced effects of Ni(P)thickness on the interfacial reaction and high impact resistance of the solder/Au/Pd(P)/Ni(P)/Cu reactive system
    C. E. Ho [2014]
  • Origin of surface defects in PCB final finishes by the electroless nickel immersion gold process
    B. K. Kim [2008]
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  • Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni (P)/Cu bond pad
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  • Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints
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  • Effect of Bath Life of Ni(P) on the Brittle-Fracture Behavior of Sn-3.0Ag-0.5Cu/ENIG
    W. Seo [2014]
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    J. Osenbach [2009]
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    김경호 [2017]
  • Correlation between chemical reaction and brittle fracture found in electroless Ni(P)/immersion goldsolder interconnection
    Y. C. Sohn [2005]
  • Characterization of the Contamination Factor of Electroless Ni Plating Solutions on the ENIG Process
    H. Lee [2018]
  • Characteristic evaluation of electroless nickel-phosphorus deposits with different phosphorus contents
    J. W. Yoon [2007]