차세대 웨어러블 디바이스를 위한 높은 기계적/전기적 특성을 갖는 CNT-Ni-Fabric 유연기판

논문상세정보
' 차세대 웨어러블 디바이스를 위한 높은 기계적/전기적 특성을 갖는 CNT-Ni-Fabric 유연기판' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • CNT spray
  • Conductive fiber
  • Ni electroless plating
  • Wearable device
  • flexiblesubstrate
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
114 0

0.0%

' 차세대 웨어러블 디바이스를 위한 높은 기계적/전기적 특성을 갖는 CNT-Ni-Fabric 유연기판' 의 참고문헌

  • 패션 웨어러블 디바이스 개발 사례 연구
    양진숙 [2015]
  • 유연 반도체 패키지 접속을 위한 폴리머 탄성범프 범핑 공정 개발 및 범프 변형 거동 분석
    이재학 [2019]
  • Thermal Transport in Conductive Polymer–Based Materials
    X. Xu [2019]
  • Spray Coating for MEMS, Interconnects, and Advanced Packaging Applications-MEMS devices with extreme topography in height and size or with square-shaped substrates can be covered with a uniform
  • Soft capacitor fibers using conductive polymers for electronic textiles
    J. F. Gu [2010]
  • Recent developments and trends in biomedical sensors
    M. Engin [2005]
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    은덕수 [2007]
  • PCB 및 패키징 공정에서의 도금 시뮬레이션 기술 적용
    이규환 [2012]
  • Nanobeam Mechanics: Elasticity, Strength, and Toughness of Nanorods and Nanotubes
    E. W. Wong [1997]
  • Materials science and Engineering, 5
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    N. Atthi [2010]
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    Z. Zhang [2015]
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    B. Zheng [2014]
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    X. Wang [2014]
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    D. Gao [2009]
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    F. Su [2014]