하이브리드 필러를 함유한 에폭시 복합체의 열적 특성 연구

이승민 노호균 이상현 2019년

논문상세정보

인용/피인용

논문영향력 요약
동일주제 총논문수	논문피인용 총횟수	주제별 논문영향력의 평균
주제	composites epoxy fillers thermal conductivity thermal expansion coefficient
354	0	0.0%

논문영향력
주제		주제별 논문수	주제별 논문영향력
주제어	composites	60	0.0%
	epoxy	77	0.0%
	fillers	9	0.0%
	thermal conductivity	204	0.0%
	thermal expansion coefficient	6	0.0%
계		356	0.0%
* 다른 주제어 보유 논문에서 피인용된 횟수

Thermally Conductive Polymer Composites for Electronic Packaging
X. Lu [1997]
Thermal-Conductivity of Metal-Matrix Composites
L. C. Davis [1995]
Thermal Properties of Graphene and Nanostructured Carbon Materials
A. A. Balandin [2011]
Thermal Management of Electronics : A Review of Literature
S. S. Anandan [2008]
Thermal Conductivity and Phonon Transport in Suspended Few-Layer Hexagonal Boron Nitride
I. Jo [2013]
The Study on the Properties of Binary Mixture(crystalline silica/AlN)Filled Epoxy Molding Compounds
W. Kim [1999]
Perspectives on Carbon Nanotubes and Graphene Raman Spectroscopy
M. S. Dresselhaus [2010]
Managing Heat for Electronics
P. K. Schelling [2005]
Hunting for Monolayer Boron Nitride: Optical and Raman Signatures
R. V. Gorbachev [2011]
Emerging Challenges and Materials for Thermal Management of Electronics
A. L. Moore [2014]
Effect of High Filler Loading on The Reliability of Epoxy Molding Compound for Microelectronic Packaging
H. Y. Jung [1999]
Advances in Composite Materials for Thermal Management in Electronic Packaging
C. Zweben [1998]