연구동향 분석

파워모듈의 TLP 접합 및 와이어 본딩

강혜준 정재필 2019년

논문상세정보
인용/피인용
' 파워모듈의 TLP 접합 및 와이어 본딩' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • TLP bonding
  • electronics packaging
  • power module
  • wire bonding
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
21 0

0.0%

' 파워모듈의 TLP 접합 및 와이어 본딩' 의 참고문헌

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    노명훈 [2017]
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    이정현 [2018]
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    윤정원 [2014]
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    노명훈 [2015]
  • Wikipedia Foundation. Lnc
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    J. P. Jung [1997]
  • Transient Liquid Phase Bonding of Copper using Sn Coated Cu MWCNT Composite Powders for Power Electronics
  • Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders of Power Electronics
  • Transient Liquid Phase Bonding : A New Method for Joining Heat Resistant Alloys
  • Reliability Enhancement of Thick Al Cu Wire Bonds in IGBT Modules Using Al2Cu Precipitates
    T. Kurosu [2012]
  • Micro-Joining (in Kor.)
    C. S. Kang [2002]
  • Mechanical Property of Liquid Phase Diffusion Bonded Joint of Rene80 / B / Rene80
    J. P. Jung [1995]
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    J. P. Jung [1995]
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    J. P. Jung [1995]
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    J. P. Jung [1996]
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    Y. Tamai [2015]
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    I. Lum [2006]
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    H. J. Kang [2019]
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    K. Kotani [2000]
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    J. P. Jung [1995]
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    J. P. Jung [1993]