연구동향 분석

그래핀 산화 분말을 첨가한 플렉시블 기판 솔더 접합부의 반복 굽힘 신뢰성 향상

고용호 유동열 손준혁 방정환 김택수 2019년

논문상세정보
인용/피인용
' 그래핀 산화 분말을 첨가한 플렉시블 기판 솔더 접합부의 반복 굽힘 신뢰성 향상' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • cyclic bending test
  • flexible substrate
  • graphene oxide (GO)
  • small outline package (SOP)
  • solder joint
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
18 0

0.0%

' 그래핀 산화 분말을 첨가한 플렉시블 기판 솔더 접합부의 반복 굽힘 신뢰성 향상' 의 참고문헌

  • 전자 패키징용 고신뢰성 나노입자 강화솔더
    정도현 [2018]
  • 자동차 전장을 위한 플렉시블 기판 무연 솔더 접합부 특성
    안성도 [2018]
  • 자동차 전장 보드용 고온 무연 솔더의 신뢰성 평가
    고용호 [2010]
  • Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Circuits in Flexible Electronics
    T. Shuto [2013]
  • Ultra-thin Chip-in-flex (CIF) Technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications
    J.-H. Kim [2015]
  • The Rise of Graphene
    A. K. Geim [2007]
  • The Effect of Solder Paste Composition on the Reliability of SnAgCu Joints
    S. Nurmi [2004]
  • Solderable and Electroplatable Flexible Electronic Circuit on A Porous Stretchable Elastomer
    G. S. Jeong [2012]
  • SMD Reliability Research Base on StolkartS Fatigue Model
    Z. Wang [2011]
  • Review on the Effect of Alloying Element and Nanoparticle Additions on the Properties of Sn-Ag-Cu Solder Alloys
  • Reliability of ACA Bonded Flip Chip Joints on LCP and PI Substrates
    L. Frisk [2006]
  • Prediction of Bending Reliability of BGA Solder Joints on Flexible Printed Circuit (FPC)
    J. Huang [2009]
  • Microstructure and Mechanical Properties of Pb-free Sn–3.0Ag–0.5Cu Solder Pastes Added with NiO Nanoparticles after Reflow Soldering Process
  • Lead-free Solders in Microelectronics
    M. Abtew [2000]
  • Lead(Pb)-free Solders for Electronic Packaging
    S. K. Kang [1994]
  • Improved Microstructure and Mechanical Properties for Sn58Bi0.7Zn Solder Joint by Addition of Graphene Nanosheets
    D. Ma [2016]
  • Failure Modes and Fatigue Testing Characteristics of SMT Solder Joints
    D. Zdzislaw [2006]
  • Fabrication of Fully Transparent Nanowire Transistors for Transparent and Flexible Electronics
    S. Ju [2007]
  • Electromigration in Pb-free Flip Chip Solder Joints on Flexible Substrates
    J. W. Nah [2006]
  • Electric Field Effect in Atomically Thin Carbon Films
  • Effects of Graphene Nanosheets on Interfacial Reaction of Sn–Ag–Cu Solder Joints
    L. Xu [2015]
  • Effects of Fe2NiO4 Nanoparticles Addition into Lead Free Sn–3.0Ag–0.5Cu Solder Pastes on Microstructure and Mechanical Properties after Reflow Soldering Process
  • Effect of Substrate Flexibility on Solder Joint Reliability. Part II : Finite Element Modeling
    Y. Lin [2005]
  • Effect of Substrate Flexibility on Solder Joint Reliability
    X. Liu [2002]
  • Effect of Graphene Oxide Nano-Sheets (GONSs) on Thermal, Microstructure and Stress–strain Characteristics of Sn-5 wt% Sb-1 wt% Ag Solder Alloy
    M. Sobhy [2016]
  • Effect of Graphene Nanosheets Reinforcement on the Performance of Sn-Ag-Cu Lead-free Solder
    X. Liu [2013]
  • Effect of Graphene Nanoplatelets on Wetting, Microstructure, and Tensile Characteristics of Sn-3.0Ag-0.5Cu (SAC) Alloy
    A. Sharma [2016]
  • Effect of Graphene Doping on Microstructural and Mechanical Properties of Sn–8Zn–3Bi Solder Joints Together with Electromigration Analysis
    X. Hu [2013]
  • Device Interconnection Technology for Advanced Thermal Conduction Modules
    S. K. Ray [1992]
  • Development and Validation of a Lead-free Alloy for Solder Paste Applications
  • 3D Integration of Ultra-thin Functional Devices Inside Standard Multilayer Flex Laminates