Multiple reflows에 따른 Sn-Cu-xCr/Cu 접합계면의 금속간화합물 거동 및 기계적 특성 연구
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Multiple reflows에 따른 Sn-Cu-xCr/Cu 접합계면의 금속간화합물 거동 및 기계적 특성 연구' 의 참고문헌
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Wetting Interaction between Pb-free Sn-Zn series Solders and Cu, Ag Substrates
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The comparative study on interfacial IMCs growth of three Cu/SnAgCu/Cu solder joints with Bi and Cr additions during thermal aging
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Study on Characteristics of Sn-0.7wt%Cu-Xwt%Re Solder
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Properties and microstructure of Sn-0.7Cu-0.05Ni solder bearing rare earth element Pr
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Preparation and Properties of Sn-9Zn-3Bi-Cr Based Lead-free Solder
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New Sn-0.7Cu-based solder alloys with minor alloying additions of Pd, Cr and Ca
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Microstructural Evolution of Sn-9Zn-3Bi and Sn-9Zn-3Bi-0.3Cr Solder Under High-temperature and High-humidity Conditions
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Mechanical Properties and Joint Reliability Improvement of Sn-Bi Alloy
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Effects of Zn addition on the drop reliability of Sn-3.5Ag-xZn/Ni(P) solder joints
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Effects of Alloying Elements on the Characteristics of Sn-Zn Lead-free Solder
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Effect of high-speed loading conditions on the fracture mode of the BGA solder joint
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Effect of 0.05% Cr on Intermetallic Compound Layer Growth for Sn-Ag-Cu Lead-free Solder Joint during Isothermal Aging
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Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblis in Shear Loading
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A Study on Tensile Characteristic of QFP Lead-free Joint for Automotive Electrical Parts
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Multiple reflows에 따른 Sn-Cu-xCr/Cu 접합계면의 금속간화합물 거동 및 기계적 특성 연구'
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