연구동향 분석

Estimating the mechanical properties of polyurethane-impregnated felt pads

이다솔 이현섭 2017년

논문상세정보
    • 저자 이다솔 이현섭
    • 제어번호 104302702
    • 학술지명 JOURNAL OF MECHANICAL SCIENCE AND TECHNOLOGY
    • 권호사항 Vol. 31 No. 12 [ 2017 ]
    • 발행처 대한기계학회
    • 자료유형 학술저널
    • 수록면 5705-5710
    • 언어 English
    • 출판년도 2017
    • 등재정보 KCI등재
    • 판매처
    유사주제 논문( 0)
인용/피인용

' Estimating the mechanical properties of polyurethane-impregnated felt pads' 의 참고문헌

  • Von mises stress in chemical‐mechanical polishing processes
    D. Wang J. Electrochem. Soc 144 3 1121-1127 [1997]
  • The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption
    이다솔 Journal of Mechanical Science and Technology 29 12 5057-5062 [2015]
  • The Influence of Abrasive Size on High-Pressure Chemical Mechanical Polishing of Sapphire Wafer
    Haedo Jeong International Journal of Precision Engineering and Manufacturing-Green Technology 2 2 157-162 [2015]
  • Slurry Components in Metal Chemical Mechanical Planarization (CMP) Process: A Review
    이다솔 International Journal of Precision Engineering and Manufacturing 17 12 1751-1762 [2016]
  • Signal Analysis of CMP Process based on AE Monitoring System
    Haedo Jeong International Journal of Precision Engineering and Manufacturing-Green Technology 2 1 15-19 [2015]
  • Mechanical Aspects of the Chemical Mechanical Polishing Process: A Review
    이현섭 International Journal of Precision Engineering and Manufacturing 17 4 525-536 [2016]
  • Mathematical Modeling of Material Removal Rate in Roll- Type Linear CMP (Roll-CMP) Process: Effect of Polishing Pad
    이현섭 International Journal of Precision Engineering and Manufacturing 17 4 495-501 [2016]
  • Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
    H. Lee Precis. Eng 49 85-91 [2017]
  • Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication
    J. Luo - [2004]
  • Finiteelement analysis on wafer-level CMP contact stress: Reinvestigated issues and the effects of selected process parameters
    K. S. Chen Int. J. Adv. Manuf. Technol 42 11 1118-1130 [2009]
  • Environmental Impact of Concentration of Slurry Components in Thick Copper CMP
    이현섭 International Journal of Precision Engineering and Manufacturing-Green Technology 4 1 13-18 [2017]
  • Effect of wafer size on material removal rate and its distribution inchemical mechanical polishing of silicon dioxide film
    이현섭 Journal of Mechanical Science and Technology 27 10 2911-2916 [2013]
  • Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process
    신철민 Journal of Mechanical Science and Technology 30 12 5659-5665 [2016]
  • Development of Green CMP by Slurry Reduction through Controlling Platen Coolant Temperature
    유민종 International Journal of Precision Engineering and Manufacturing-Green Technology 2 4 339-344 [2015]
  • Chemical mechanical polishing and grinding of silicon wafers
    X. Zhang [2007]
  • CMP profile simulation using an elastic model based on nonlinear contact analysis
    Y. H. Kim 69-72 [1997]
  • Brittle and ductile fracture mechanics analysis of surface damage caused during CMP
    T. A. Ring J. Electrochem. Soc. 154 3 H239-H248 [2007]
  • Analysis of Pressure Distribution and Verification of Pressure Signal by Changes Load and Velocity in Chemical Mechanical Polishing
    이창석 International Journal of Precision Engineering and Manufacturing 16 6 1061-1066 [2015]
  • A wafer-scale material removal rate profile model for copper chemical mechanical planarization
    H. Lee Int. J. Mach. Tool Manu 51 5 395-403 [2011]
  • A hybrid model combining simulation and optimization in chemical mechanical polishing process
    Y. Y. Lin J. Mater. Proc. Technol 202 1 156-164 [2008]