UHD급 영상구현을 위한 다층인쇄회로기판의 특성 임피던스 분석에 관한 연구

논문상세정보
' UHD급 영상구현을 위한 다층인쇄회로기판의 특성 임피던스 분석에 관한 연구' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • high-speedvideodifferentialsignaling
  • multi-layer pcb
  • signal integrity
  • tdr
  • uhd
  • 고속영상차동신호
  • 다층인쇄회로기판
  • 시간영역반사율
  • 신호 무결성
  • 초고해상도
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
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' UHD급 영상구현을 위한 다층인쇄회로기판의 특성 임피던스 분석에 관한 연구' 의 참고문헌

  • V-by-One HS Standard Version 1.4
  • Ultra high-definition color video camera system with 8K x 4K pixels
    K. Mitani Journal of Electronic Imaging 17 (2) [2008]
  • The Impact of Common Mode Currents on Signal Integrity and EMI in High-Speed Differential Data Links
    S. Connor Electromagnetic Compatibillity, IEEE International Symposium on : 1 ~ 5 [2012]
  • Signal-power integrity co-simulations of high speed systems via chip-package-CB co-analysis methodology
    W. Jiwei Electronic Packaging Technology (ICEPT), 14th International Conference : 485 ~ 491 [2013]
  • Signal Integrity Analysis for High Speed Digital Circuit
    E. T. M. Shang Intelligent and Advanced Systems(ICIAS), International Conference on 6 : 1 ~ 6 [2010]
  • Power Integrity Analysis for High-Speed PCB
    L. -X. Wang First Int. Conf. on PCSPA : 414 ~ 418 [2010]
  • High speed serial interface for mobile LCD driver IC
    H.-K. Jeon ISCAS Circuits and Systems : 157 ~ 160 [2008]
  • Effects on return loss due to microstrip line radial bends and via density
    E. -M. Kim IEEE Antennas and Propagation Society Int. Symp : 3101 ~ 3104 [2007]
  • Display signal interface techniques for mobile applications
    D. H. Kim Quality Electronic Design (ASQED), 2011 3rd Asia Symposium 7 [2011]
  • Display signal interface techniques for mobile applications
    K. Cho 3rd Asis Symp. on Quality Electronic Design : 105 ~ 108 [2011]
  • Design of Test Pattern Databank for Functional Testing of LCD Panels
    S.-L. Chung IEEE Int. Symp. on Industrial Electronics : 3002 ~ 3007 [2006]
  • Design of LVDS driver based CMOS transmitter for a high speed serial link
    W. Park Int. Conf. on ICEIE [2010]
  • Analysis of differential termination technique in cascading of high speed LVDS signals on a PCB
    D. Chowdhury India Annual Conference, Proceedings of the IEEE INDICON : 557 ~ 560 [2004]