연구동향 분석

열시효 처리된 무연 솔더 볼 연결부의 충격 전단강도 평가

정진성 ( Chin Sung Chung ) 김호경 ( Ho Kyung Kim ) 2015년

논문상세정보
인용/피인용
' 열시효 처리된 무연 솔더 볼 연결부의 충격 전단강도 평가' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • fracture toughness
  • impactshearstrength
  • interfacefailure
  • lead-freesolderjoint
  • thermal aging
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
51 0

0.0%

' 열시효 처리된 무연 솔더 볼 연결부의 충격 전단강도 평가' 의 참고문헌

  • 고속 변형률 속도에서의 무연 솔더 볼 연결부의 강도 평가
    주세민 한국안전학회지 26 (6) : 7 ~ 13 [2012]
  • Solder Joint Reliability Evaluation of Sn-Zn/Au/Ni/Cu Ball-grid-array Package during Aging
    J. W. Yoon Mater. Sci. Eng. A, 452-453 : 46 ~ 54 [2007]
  • Reliability Studies of Sn-9Zn/Cu Solder Joints with Aging Treatment
    J. W. Yoon J. Alloy. Compounds 407 : 141 ~ 149 [2006]
  • Microstructure and Shear Strength of Sn37Pb/Cu Solder Joints Subjected to Isothermal Aging
    X. Hu Microelectronics Reliability 54 : 1575 ~ 1582 [2014]
  • Mechanical Properties of Lead-free Solder Joints under High-speed Shear Impact Loading
    V. L. Nguyen J. Electron. Mater 43 : 4171 ~ 4178 [2014]
  • Manufacturing Concerns of the Electronic Industry Regarding Inter-metallic Compound Formation during the Soldering Stage
    H. D. Blair IEEE/CMPT Int. El. Mfg 19 : 282 ~ 292 [1996]
  • Improving the Impact toughness of Sn-Ag-Cu/Cu-Zn Pb-free Solder Joints under High Speed Shear Testing
    C. Y. Yu J. Alloy. Compound 586 : 633 ~ 638 [2014]
  • Evolution of Intermetallic Compounds between Sn–0. 3Ag–0. 7Cu Low-silver Lead-free Solder and Cu Substrate during Thermal Aging
    N. Mookam J. Mater. Sci. Technol 28 (1) : 53 ~ 59 [2012]
  • Effects of Bump Size on Deformation and Fracture Behavior of Sn3. 0Ag0. 5Cu/Cu Solder Joints during Shear Testing
    Y. H. Tian Mater. Sci. Eng. A 529 : 468 ~ 478 [2011]
  • A Review of Board Level Solder Joints for Mobile Applications
    E. H. Wong Microelectronics Reliability 48 : 1747 ~ 1758 [2008]