연구동향 분석

자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구

유동열 고용호 방정환 이창우 Yu, Dong-Yurl Ko, Yong-Ho Bang, Junghwan Lee, Chang-Woo 2015년

논문상세정보
인용/피인용
' 자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • al(si)
  • electriccontrolunit(ecu)
  • intermetallic compound (imc)
  • lead-free solder
  • organic solderability perseveration (osp)
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
21 0

0.0%

' 자동차 전장부품을 위한 Sn-0.5Cu-(X)Al(Si) 중온 솔더의 접합특성 연구' 의 참고문헌

  • Wetting Interaction between Pb-free Sn-Zn series Solders and Cu, Ag Substrates
    K. l. Lin Electronic Compound and Technology Coference [2003]
  • Sn-Ag-Cu-X 무연솔더로 솔더링 된 접합부의 진동파괴 거동
    진상훈 대한용접접합학회지 30 (2) : 65 ~ 69 [2012]
  • Mechanical Properties and Joint Reliability Improvement of Sn-Bi Alloy
    J. Wang 13th Electronics Packaging Technology conference [2011]
  • Evaluation on Reliability of High Temperature Leadfree Solder for Automotive Electronics
    Yong-Hob Ko Journal of Microelectronics & Packaging Society 17 (4) : 35 ~ 40 [2010]
  • Effects of Alloying Elements on the Characteristics of Sn-Zn Lead-free Solder
    X. Chen 6th International Conference Electronics Packaging Technology Conference [2005]
  • Effect of Ag on Ripening Growth of Cu6Sn5Grains Formed between Molten Sn-xAg-0.5Cu Solders and Cu
    M. G. Cho 2010 EPTC Proceeding : 170 ~ [2010]
  • Creep Behavior of Mixed SAC 405/SnPb Soldered Assemblis in Shear Loading
    P. Limaye 9th Electronics Packaging Technology Conference [2007]
  • Corrosion Performance of Pb-free Sn-Zn Solders in Salt Spray
    Huang Dan ICEPT-HDP [2008]
  • A Study on Tensile Characteristic of QFP Lead-free Joint for Automotive Electrical Parts
    S. I. Son Korean Society of Precision Engineering : 1103 ~ 1104 [2010]