연구동향 분석

공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석

박동현 정동명 오태성 Park, D.H. Jung, D.M. Oh, T.S. 2014년

논문상세정보
인용/피인용
' 공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • dieattachfilm
  • epoxymolding
  • flipchip
  • package-on-package
  • pop
  • warpage
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
72 0

0.0%

' 공정 단계에 따른 박형 Package-on-Package 상부 패키지의 Warpage 특성 분석' 의 참고문헌

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