연구동향 분석

인공시효시간에 따른 Ni 기판 Pb-free 솔더접합부의 기계적 물성평가

박소영(Soyoung Park) 양성모(Sungmo Yang) 유효선(Hyosun Yu) 2015년

논문상세정보
인용/피인용
' 인공시효시간에 따른 Ni 기판 Pb-free 솔더접합부의 기계적 물성평가' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • artificial aging(인공시효)
  • pb-free solder joint(무연솔더 접합부)
  • shear strength(전단강도)
  • sp test(shear-punch test
  • sp 시험)
  • total fracture energy(총파괴에너지)
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
12 0

0.0%

' 인공시효시간에 따른 Ni 기판 Pb-free 솔더접합부의 기계적 물성평가' 의 참고문헌

  • The Evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders During High Temperature Aging
    Seo, S. K. Microelectronics Reliability : 246 ~ 251 [2009]
  • The Evaluation of Creep Property for Lead-free Solder Joints of Sn-Ag and Sn-Ag-Cu Alloy System
    Yang, Z. Chonbuk National University [2012]
  • Prediction of Primary Intermetallic Compound Formation During Interfacial Reaction Between Sn-based Solder and Ni Substrate
    Choi, W. K. Scripta Materialia 46 : 777 ~ 781 [2002]
  • Ni-P/Au UBM을 갖는 Pb-free 솔더 접합부의 전단강도 평가에 관한 연구
    조성근 한국생산제조시스템학회지 20 (2) : 187 ~ 192 [2011]
  • Joint Strength Between Sn-Ag Based Lead-free Solder and Cu Pad by Ball Shear Test
    Hiroshi, N. Transaction of JWRI 35 (2) [2006]
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    Chen, W. M. Microelectronics Reliability : 155 ~ 160 [2006]
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    Yang, S. T. Journal of the Microelectronics & Packaging Society 2 : 1 ~ 9 [2002]
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    Sharif, A. Materials Science and Engineering B 113 : 184 ~ 189 [2004]
  • Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn–Cu–Ni (SCN) Lead-free Solder Joints
    Yang, Chaoran Microelectronics Reliability 54 : 435 ~ 446 [2014]
  • Evaluation of Mechanical Property for Pb-free Solder/Ni and Cu Plate Joints with Reflow Time
    Ha, B. R. Chonbuk National University [2012]
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    Kim, S. A. Chonbuk National University [2012]
  • Effects of Sb Addition on Tensile Strength of Sn-3.5Ag-0.7Cu Solder Alloy and Joint
    Li, G. Y. Thin Solid Films 504 [2006]
  • Effect of Cr Additions on Interfacial Reaction Between the Sn-Zn-Bi Solder and Cu/electroplated Ni Substrates
    Bi, Jinglin Microelectronics Reliability : 361 ~ 369 [2011]