연구동향 분석

실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험

김영필(Young-Pil Kim) 고석철(Seok-Cheol Ko) 2015년

논문상세정보
인용/피인용
' 실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • 전등, 조명,
  • chiponboard(cob)
  • led package
  • reliability test
  • si sub-mount
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
377 0

0.0%

' 실리콘 서브 마운틴 기반의 LED 패키지 재료평가 및 신뢰성 시험' 의 참고문헌

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    H. H. Kim Microelectron. Reliab 48 (3) : 445 ~ 454 [2008]
  • Thermal measurements and analyses of low-cost high-power LED packages and their modules
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