연구동향 분석

플립칩의 설계변수 변화에 따른 보드레벨 플립칩에서의 낙하충격 수명예측

이수진(Soo Jin Lee) 김성걸(Seong Keol Kim) 2015년

논문상세정보
인용/피인용
' 플립칩의 설계변수 변화에 따른 보드레벨 플립칩에서의 낙하충격 수명예측' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • 공구와 제작
  • designparameters
  • dropsimulations
  • flipchips
  • impactlifetime
  • solder balls
  • ubm
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
207 0

0.0%

' 플립칩의 설계변수 변화에 따른 보드레벨 플립칩에서의 낙하충격 수명예측' 의 참고문헌

  • 플립칩의 매개변수 변화에 따른 보드레벨의 동적신뢰성평가
    김성걸 한국생산제조시스템학회지 20 (5) : 559 ~ 563 [2011]
  • 언더필을 고려한 Sn-1.0Ag-0.5Cu 조성의 솔더볼을 갖는 플립칩에서의 보드레벨 낙하 및 진동해석
    김성걸 한국생산제조시스템학회지 21 (2) : 225 ~ 231 [2012]
  • The Prediction of Impact Life Time in Solder Balls of the Board Leveled Flip Chips by Drop Simulations
    Jang C. M. The Korean Society of Manufacturing Technology Engineers 23 (3) : 237 ~ 242 [2013]
  • Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling
    O'Keefe, M. ASME International Mechanical Engineering Conference and Exposition 5 (13-19) : 45 ~ 53 [2009]
  • Low-Cycle Fatigue Behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi Lead-Free Solders
    Chaosuan K. Journal of Electronic Materials 31 (5) : 459 ~ [2002]
  • Influence of Cyclic Strain-Hardening Exponent on Fatigue Ductility Exponent for a Sn-Ag-Cu Micro-Solder Joint
    Yoshihiko, K. Journal of Electronic Materials 41 (3) : 582 ~ 586 [2012]
  • Impacts of Cooling Technology on Solder Fatigue for Power Modules in Electric Traction Drive Vehicles, Institute of Electrical and Electronics Engineers
    O'Keefe, M. Conference Publications : 1182 ~ 1188 [2009]
  • Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies
    Popelar, S. The International Journal of Microcircuits and Electronic Packaging 23 (4) : 462 ~ 468 [2000]
  • Failure Behaviors of Flip Chip Solder Joints Under Various Loading Conditions of High-speed Shear Test
    Ha, S. S. International Journal of Modern Physics B 23 (6) : 1809 ~ 1815 [2009]
  • Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects
    Yoshiharu, K. Journal of Electronic Materials 33 (4) : 326 ~ 327 [2004]
  • Dynamic Analysis of Flip Chips with Solder Balls with Two Different Compositions
    Kim, S. K. Korea Society for Precision Engineering Conference : 207 ~ 208 [2009]
  • Drop Impact Analysis of Sn-Ag-Cu Solder Joints using Dynamic High-strain Rate Plastic Strain as the Impact Damage Driving Force
    John, H. L. P. Electronic Components and Technology Conference : 3 ~ 4 [2006]
  • Database for Solder Properties with Emphasis on New Lead-free Solders
    Siewert, T. [2002]
  • A study on Reliability of Flip-chip Solder Joints with Lead-free Sn-1.2Ag-0.7Cu and Sn-2.5 at solders
    Kim, J. Y. Seoul National University of Technology [2008]
  • A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
    Blattau, N. Proceedings of SMTA International Annual Conference : 3 ~ 16 [2005]