연구동향 분석

낙하해석을 통한 보드 레벨 플립칩에서의 솔더볼 충격수명에 관한 연구

장총민(Chong Min Jang) 김성걸(Seong Keol Kim) 2014년

논문상세정보
인용/피인용
' 낙하해석을 통한 보드 레벨 플립칩에서의 솔더볼 충격수명에 관한 연구' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • 공구와 제작
  • dropimpactreliability
  • finite element method
  • flipchip
  • non-lineardynamicanalysis
  • solder ball
  • strainlifeanalysis
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
421 0

0.0%

' 낙하해석을 통한 보드 레벨 플립칩에서의 솔더볼 충격수명에 관한 연구' 의 참고문헌

  • 언더필을 고려한 Sn-1.0Ag-0.5Cu 조성의 솔더볼을 갖는 플립칩에서의 보드레벨 낙하 및 진동해석
    김성걸 한국생산제조시스템학회지 21 (2) : 225 ~ 231 [2012]
  • Validation and reliability assessment of board level drop test of chip scalepackaging
    Hung, T. Y. International Conference on Experimental Mechanics 7375 : 4 ~ [2008]
  • Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling
    O'Keefe, M. ASME International Mechanical Engineering Conference and Exposition : 3 ~ [2009]
  • Impacts of Cooling Technology on Solder Fatigue for Power Modules in Electric Traction Drive Vehicles
    O'Keefe, M. Institute of Electrical and Electronics Engineers : 5 ~ [2009]
  • Flip Chip Reliability Modeling Based on Solder Fatigue as Applied to Flip Chip on Laminate Assemblies
    Popelar, S. The International Journal of Microcircuits and Electronic Packaging 23 (4) : 462 ~ 468 [2000]
  • Failure Behaviors of Flip Chip Solder Joints Under Various Loading Conditions of High-speed Shear Test
    Ha, S. S. International Journal of Modern Physics B 23 (6) : 1809 ~ 1815 [2009]
  • Effect of Surrounding Air on Board Level Drop Tests of Flexible Printed Circuit Boards
    Arruda, L. IEEE : 1 ~ 4 [2007]
  • Dynamic Analysis of Flip Chips with Solder Balls with Two Different Compositions
    Kim, S. K. Korea Society for Precision Engineering : 1 ~ 2 [2009]
  • Drop Impact Analysis of Sn-Ag-Cu Solder Joints using Dynamic High-strain Rate Plastic Strain as the Impact Damage Driving Force
    John, H. L. P. Electronic Components and Technology Conference : 3 ~ 4 [2006]
  • Database for Solder Properties with Emphasis on New Lead-free Solders
    Siewert, T. National Institute of Standards and Technology & Colorado School of Mines : 1 ~ 65 [2002]
  • Board Level Drop Test Simulation for an Advanced MLP
    Liu, Y. Institute of Electrical and Electronics Engineers : 1 ~ 4 [2007]
  • A study on Reliability of Flip-chip Solder Joints with Lead-free Sn-1.2Ag-0.7Cu and Sn-2.5 at solders
    Kim, J. Y. Seoul National University of Technology, [2008]
  • A Comparison of the Isothermal Fatigue Behavior of Sn-Ag-Cu to Sn-Pb Solder
    Blattau, N. Proceedings of SMTA International Annual Conference : 1 ~ 18 [2005]