박사

유무기 복합공정을 이용한 고열전도성 절연금속기판 제조 및 특성분석 = Fabrication and characterization of insulated metal substrates with high thermal conductivity prepared by inorganic-organic hybrid process

김성협 2018년
논문상세정보
' 유무기 복합공정을 이용한 고열전도성 절연금속기판 제조 및 특성분석 = Fabrication and characterization of insulated metal substrates with high thermal conductivity prepared by inorganic-organic hybrid process' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • 기술과 연합작용
  • Insulated metal substrate
  • breakdown voltage
  • coating mixture
  • organic ceramic composite
  • sol‐gel
  • thermal conductivity
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
961 0

0.0%

' 유무기 복합공정을 이용한 고열전도성 절연금속기판 제조 및 특성분석 = Fabrication and characterization of insulated metal substrates with high thermal conductivity prepared by inorganic-organic hybrid process' 의 참고문헌

  • Y. Aoki, Heat-resistant, thermally conductive coating of alumina on metal via electrophoretic deposition with added poly dimethylsiloxane-based organic-inorganic hybrid materials, Polym. Bull. 73 (2016) 2605-2614.
  • T. Olding, M. Sayer, D. Barrow, Ceramic sol–gel composite coatings for electrical insulation, Thin Solid Films 398‐399 (2001) 581‐586.
  • S. Kim. G. Kim, H. Lim, B. Lee, J. Nah, Optimum synthesis and characterization of precursor solution for a hard coating silica film prepared by sol-gel process, Bull. Korean Chem. Soc. 21 (2000) 817‐822.
  • S. Di Pascoli, P. E. Bagnoli, C. Casarosa, Thermal analysis of insulated metal substrates for automotive electronic assemblies, Microelectron. J. 30 (1999) 1129‐1135.
  • R. Kochetov, T. Andritsch, P. H. F. Morshuis, J. J. Smit, Thermal and electrical behavior of epoxy-based microcomposites filled with Al2O3 and SiO2 particles, IEEE International Symposium on Electrical Insulation, SanDiego, CA, USA, (2010).
  • R. Gvishi, Fast sol-gel technology: from fabrication to applications, J. Sol-Gel Sci. Technol. 50 (2009) 241-253.
  • Q. Yang, X. Li, L. Shi, X. Yang, G. Sui, The thermal characteristics of epoxy resin: Design and predict by using molecular simulation method, Polymer 54 (2013) 6447‐6454.
  • P. Anithambigai, M. K. Dheepan Chakravarthii, D. Mutharasu, L. H. Huong, T. Zahner, D. Lacey, I. Kamarulazizi, Potential thermally conductive alumina filled epoxy composite for thermal management of high power LEDs, J. Mater. Sci: Mater. Electron 28 (2017) 856-867.
  • M. Niittym ki, K. Lahti, T. Suhonen, J. Metsajoki, Dielectric breakdown strength of thermally sprayed ceramic coatings: effects of different test arrangements, J. Therm. Spray Tech. 24 (2015) 542-551.
  • L. Pawłowski, The relationship between structure and dielectric properties in plasma-sprayed alumina coatings, Surf. Coatings Technol. 35 (1988) 285-298.
  • K. Wattanakul, H. Manuspiya, N. Yanumet, The adsorption of cationic surfactants on BN surface: Its effects on the thermal conductivity and mechanical properties of BN-epoxy composite, Colloids and Surfaces A: Physicochem. Eng. Aspects 369 (2010) 203–210.
  • K. Monden, Equivalent thermal conductivity of insulating layer in insulated metal substrates, Adv. Sci. Techno. 45 (2006) 2664-2669.
  • J. Zhu, Y. Liu, L. Guo, J. Ma, D. Mu, Preparation of insulated metal substrate for MBGA package, J. Mater. Sci. 13 (2002) 597-600.
  • J. P. Hong, S. W. Yoon, T. Hwang, J. S. Oh, S.-C. Hong, Y. Lee, J.-D. Nam, High thermal conductivity epoxy composites with bimodal distribution of aluminum nitride and boron nitride fillers. Thermochim. Acta 537 (2012) 70–75.
  • J. J. Park, Electrical Insulation Breakdown Strength in Epoxy/Spherical Alumina Composites for HV Insulation, Trans. Electr. Electron. Mater. 14 (2013) 105‐109.
  • H. Yu, L. Li, T. Kido, G. Xi, Dielectric Composite Material with Enhanced Thermal Conductivity Used for Electronic Packaging, IEEE 11th International Conference on Electronic Packaging Technology & High Density Packaging Xi'an, China (2010) 258-262.
  • H. Kim, T. Troczynski, Thick alumina dielectric films on aluminum through chemically bonded composite sol–gel, Ceram. Int. 33 (2007) 333–336.
  • H. J. Kim, S. Odoul, C. H. Lee, Y. G. Kweon, The electrical insulation behavior and sealing effects of plasma-sprayed alumina titania coatings, Surf. Coat. Technol. 140 (2001) 293–301.
  • F. L. Toma, L. M. Berger, S. Scheitz, C. Rodel, A. Potthoff, V. Sauchuk, M. Kusnezoff, Comparison of the Microstructural Characteristics and Electrical Properties of Thermally Sprayed Al2O3CoatingsfromAqueousSuspensionsandFeedstockPowders,J.Therm.SprayTech.21(2012)480-488.
  • F. L. Jin, S. J. Park, Thermal properties of epoxy resin/filler hybrid composites, Polym. Degrad. Stabil. 97 (2012) 2148‐2153.
  • D. A. Barrow, T. E. Petroff, R. Tandon, M. Sayer, Characterization of thick lead zirconate titanate films fabricated using a new sol gel based process, J. Appl. Phys. 81(1997) 876‐879.
  • C. J. Brinker, G. W. Scherer, Sol‐gel science, the physics and chemistry of sol‐gel processing. Academic press, Boston, (1990).