연구동향 분석
박사

EBG(Electromagnetic Band Gap)을 이용한 통신시스템의 PDN(Power Delivery Network) 안정화에 대한 연구 = A Study on Power Delivery Network stabilization of Communication System using the Electromagnetic Band Gap

정기현 2016년

논문상세정보
인용/피인용
' EBG(Electromagnetic Band Gap)을 이용한 통신시스템의 PDN(Power Delivery Network) 안정화에 대한 연구 = A Study on Power Delivery Network stabilization of Communication System using the Electromagnetic Band Gap' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • pdn
  • 전원안정화
  • 통신시스템
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
14 0

0.0%

' EBG(Electromagnetic Band Gap)을 이용한 통신시스템의 PDN(Power Delivery Network) 안정화에 대한 연구 = A Study on Power Delivery Network stabilization of Communication System using the Electromagnetic Band Gap' 의 참고문헌

  • 전원무결성 해석에 의한 PCB 전원안정화 설계기법 연구
  • “위성항법시스템 운영 현황 및 개발 계획”
    천세범 하지현 항공우주 산업기술동향, 제8권, 제2호, pp. 46~53 [2010]
  • “위성항법시스템 및 보강시스템의 구축 현황”
    남기욱 심주영 허문범 항공우 주산업기술동향, 제5권, 제1호, pp. 65~74 [2007]
  • “위성측위시스템(GNSS) 구축 및 이용 활성화 방안”
    정보통신부, pp. 1∼18 [2000]
  • “동시스위칭노이즈 억제를 위한 나선형 구조와 개방 스터브 가 적용된 전원면 설계”
    김보배 석사학위논문, 충남대학교, 충남 [2009]
  • “PI/EMI를 고려한 패키지 및 PCB 보드 설계”
    조성곤 석사학위논문, 숭실대학교, 서울 [2008]
  • “PCB에서의 SSN 저감 기술에 관한 연구”
    양국보 석사학위논문, 포 항공과대학교, 포항 [2010]
  • “PCB 내장형 캐패시터 기술”
    강민규 강종윤 다기능 고집적 3D 패 키지용 세라믹스 소재 및 공정기술, 제15권 제1호, p. 28~31 [2012]
  • “Mushroom 형태의 EBG 구조를 집적한 마이 크로스트립 패치안테나의 방사 특성 해석”
    곽은혁 김부균 김태영 전자공학회논문지, 제46권, 제8호, pp. 67~78 [2009]
  • “GBN/SSN 억제를 위한 이종 셀 구조를 갖는 전원면”
    김동엽 이해영 주성호 한국전자파학회 한국전자파학회논문지, 제18권, 제2호, pp. 206~212 [2007]
  • “EBG(Electromagnetic Band-Gap) 접지면을 갖 는 개선된 U-Slotted 패치 안테나의 설계”
    박종환 임성빈 최학근 한국전자파학회 한국전자파학회논문 지, 제19권, 제3호, pp. 304~310 [2008]
  • “A-GNSS(위성항법시스템) 표준 동향”
    공승현 표준 기술동향, TTA Journal, 제138권, pp. 85~89 [2010]
  • “ 전자파 장해 저감 기술 연구 동향”
    권종화 최형도 한국전자파학회 전자파기술, 제18권, 제1호, pp. 32~42 [2007]
  • “ Global-Navigation Satellite Service를 위한 Electromagnetic Band Gap 구조체 설계”
    김성권 여성대 장영진 정기현 정창원 한국전자통신학회, 제10 권, 제1호, pp. 27~32 [2015]
  • [17]R. Abhari and G. V. Elefteriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits,” IEEE Trans. Microwave Theory and Technique, vol. 51, no. 6, pp. 1629-1639, June 2003.
  • Y. Imanaka, T. Shioga and J. D. Baniecki, “Decoupling Capacitor with Low Inductance for High-Frequency Digital Applications” FUJISU Sci. Tech. J., vol.38, no.1, pp.22~30.
  • W. Cui, J. Fan, Y. Ren, H. Shi, J. L. Drewniak, and R.E. DuBroff, “DC power bus noise isolation with power plane segmentation,” IEEE Trans. Electromagnetic Compatibility, vol. 45, no. 2, pp. 436-444, May 2003.
  • V. Ricchiuti. (2001). “Power-Supply Decoupling on Fully Populated High-Speed Digital PCBs” IEEE Trans. EMC, vol. 43, pp.671~676.
  • V. Ricchiuti, "Power-supply decoupling on fully populated high-speed digital PCBs," IEEE Trans. Electromagnetic Compatibility, vol. 43, no. 4, Nov. 2001, pp. 671-676.
  • Tomoji Takasu. (2006). "2.6 High-rate precise point positioning: observation of crustal deformation by using 1-Hz GPS data 2006, Japan, pp. 1-8.
  • T.-L.Wu,Y.-H Lin,T.-K.Wang,C.-C.Wang and S.-T Chen,"Electromagnetic Bandgap Power/Ground Planes for Wideband Suppression ofGround Bounce Noise and Radiated Emission in High-Speed Circuits," IEEE Trans.on Microwave Theory and Techniques,vol.53,no.9,pp.2935-2942,Sep.2005
  • T. Kamgaing, and O. M. Ramahi, "Inductance enhanced high-impedance surfaces for broadband simultaneous switching noise mitigation in power planes," In Proc. IEEE MTT-S Int. Microw. Symp. Digest, vol. 3, June 2003, pp. 2165-2168.
  • S.S.Mohan,M.M.Hershenson,S.P.Boyd and T.H.Lee,"Simple Accurate Expressions for Planar Spiral Inductances," IEEE Journal of Solid-state Circuits, vol.34,No.10,Oct.,1999
  • S. Shahparnia, O. M. Ramahi. (2004). "Electromagnetic interference(EMI) reduction from printed circuit boards (PCB) using electromagnetic band gap structures", IEEE Trans. EMC, vol. 46, no. 4, pp. 580~587.
  • S. Shahparnia, O. M. Ramahi, "Simultaneous switching noise mitigation in PCB using cascaded highimpedance surfaces", IEE Electron. Lett., vol. 40, no. 2, pp. 98-100, Jan. 2004.
  • S. Shahparnia, B. Mohajajer-Iravani, and O. M. Ramahi, “Eletromagnetic noise mitigation in high-speed printed circuit boards and packaging using electromagnetic bandgap structures,” 54th Electronic Components and Technology Conf., Las Vegas, NV, June 2004, pp. 1831-1836.
  • S. Shahparnia and O. M. Ramahi, "Electromagnetic interference(EMI) reduction from printed circuit boards (PCB) using electromagnetic band gap structures," IEEE Trans. Electromagnetic Compatibility, vol. 46, no. 4, Nov. 2004, pp. 580-587.
  • S. Radu, R. E. DuBroff, J. L. Drewniak, T. H .Hubing and T. P. Van Doren. (1998). “Designing Power Bus Decoupling for CMOS Devices,” in Proc. IEEE Int. Symp. EMC, Denver, CO, vol.1, pp.375~380.
  • S. Radu and D. Hockanson. (1999). “An investigation of PCB radiated emissions from simultaneous switching noise”, in Proc. IEEE Int. Symp. Electromagnetic Compatibility, Seattle, vol. 2, pp. 893~898.
  • S. Radu and D. Hockanson, "An investigation of PCB radiated emissions from simultaneous switching noise," In Proc. IEEE Int. Symp. Electromagnetic Compatibility, Seattle, WA, vol. 2, Aug. 1999, pp. 893-898.
  • R. Abhari, "Modeling of Via interconnects in parallel plate environments and suppression of the induced ground/power plane", Ph. D. dissertation, Dept. Elect. Comp. Eng., Univ. of Toronto, 2003.
  • M. Xu, T. H. Hubing, J. Drewniak, T. Van Doren, and R. E. DuBroff, "Modeling printed circuit boards with embedded decoupling capacitance," IEEE Int. Symp. Electromagnetic Compatibility, Montreal, Canada, Aug. 2001, pp. 515-520.
  • M. Ramahi, S. Shahparnia, and B. Mohajer-Irvani, "Electromagnetic band gap material: Exotic stuff for not-so-exotic EMI/EMC applications", Interference Technology - The Annual EMC Guide 2004, Item Publications.
  • M. Rahman and M. A. Stuchly. (2001). “Transmission line – periodic circuit representation of planar microwave photonic bandgap structures,” Microwave Optical Tech. Lett., vol. 30, no. 1, pp. 15~19.
  • Leo Raimondo, Francesco de Paulis, Antonio Orlandi (2009). “Fundamental Mechanisms of Planar EBG Structures Applications”, pp. 54~57.
  • J. Ju, J. Lee, and D. Park, "Analysis of coupling between PCB traces using a circuitconcept approach," 2004 Int. Symp. Electromagn. Environ. Tech., Daejeon, Korea, May 2004, pp. 1185-1188.H. Sun, W. Kwok, and J. Zdepski, “Architectures for MPEG compressed bitstream scaling,” IEEE Trans. Circuits Syst. Video Technol., vol. 6, no. 2, pp. 191-199, Apr. 1996.
  • H. Liaw and H. Merkelo, “Signal integrity issues at split ground and power planes,” Proceedings of Electronic Components and Technology Conference, pp. 752-755, May 1996.
  • G. T Lei, R. W. Techentin, Paul R. Hayes, Daniel J. Schwab, and Barry K. Gilbert. (1995). "Wave Model Solution to the Ground/Power Plane Noise Problem", IEEE Trans. Instrumentation and measurement, vol. 44, no.2, pp.300~301.
  • G. T Lei, R. W. Techentin, P. R. Hayes, D. J. Schwab, and B. K. Gilbert, "Wave Model Solution to the Ground/Power Plane Noise Problem," IEEE Trans. Instrumentation and Measurement, vol. 44, no. 2, Nov. 1995, pp. 300-303.
  • D. Sievenpiper, L. Zhang, R. F. J. Broas, N. G.Alexopolous, and E. Yablonovitch. (1999). "High impedance electromagnetic surfaces with a forbidden frequency band", IEEE Trans. MTT, vol. 47, no. 11, pp. 2059~2074.
  • D. Sievenpiper, L. Zhang, R. F. J. Broas, N. G.Alexopolous, and E. Yablonovitch, "High impedance electromagnetic surfaces with a forbidden frequency band," IEEE Trans. Microwave Theory and Techniques, vol. 47, no. 11, Nov. 1999. pp. 2059-2074.
  • D. Sievenpiper, E. Yablonovitch, "Eliminating surface currents with metallo-dielectric photonic crystals", in Proc. IEEE MTT-S Int. Microw. Symp. Digest, vol. 2, pp. 663-666, Jun. 1998.
  • D. F. Sievenpiper. (1999). High Impedance electromagnetic surfaces, Ph.D. dissertation, Electrical Engineering Department, University of California, Los Angeles.
  • Bobae kim, and Dong Wook kim“Localized and Periodic Spiral-Shaped EBG Structures for the Simultaneous Switching Noise Mitigation,” IEEE Trans. Microwave Theory and Technique, vol. 51, no. 6, pp. 1629-1639, June 2003.
  • B.Kim and D.W.Kim,"Localized and Periodic Spiral-Shaped EBG Structures for the Simultaneous Switching Noise Mitigation," 2008 EuMC European Microwave Conference, Amsterdam,pp.183-186,Oct.2008
  • B. Mohajer-Iravani, S. Shahparnia, and O. M. Ramahi, "Coupling reduction in enclosures and cavities using electromagnetic band gap structure", IEEE Trans. EMC, vol. 48, no. 2, pp. 292-303, May 2006