연구동향 분석
박사

저융점합금-에폭시를 이용한 OLED 봉지에 대한 연구 = Sutudy on OLED encapsulation with LMPA-EPOXY

권혜경 2016년

논문상세정보
    • 저자 권혜경
    • 형태사항 89: 26 cm
    • 일반주기 지도교수: 문철희
    • 학위논문사항 디지털디스플레이공학과 디스플레이, 학위논문(박사)-, 호서대학교 일반대학원, 2016. 2
    • 발행지 천안
    • 언어 kor
    • 출판년 2016
    • 발행사항 호서대학교 일반대학원
    • 주제어 OLED 봉지기술 저융점금속
    유사주제 논문( 282)
인용/피인용
' 저융점합금-에폭시를 이용한 OLED 봉지에 대한 연구 = Sutudy on OLED encapsulation with LMPA-EPOXY' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • oled
  • 봉지기술
  • 저융점금속
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
285 0

0.0%

' 저융점합금-에폭시를 이용한 OLED 봉지에 대한 연구 = Sutudy on OLED encapsulation with LMPA-EPOXY' 의 참고문헌

  • 전극의 형성 방법 및 이를 이용한 태양전지의 제조방법
    Nakamura Goro Nomura Shoichi KR patent No. -113675 [2011]
  • “주울가열에 의한 저융점합금-에폭시 이중라인형 OLED봉지에 대한 연구“
    박경민 석사학위논문 [2014]
  • “디스플레이 공학”
    엄금용 기전연구사 [2008]
  • “OLED 산업 현황과 전망”
    김윤지 Issu Briefing 패ㅣ. -I-06, 2012 [2012]
  • W. C .Lo, C. C. Chiang, H. B. Lin, L. S. Chang, R. H. Horng, C. L. Huang and Y. J. Gao, "Plasma-depositied silicon oxide barrier films on polyethersulfone substrates;temperature and thickness effects", Surface & Coatings Technology 197, pp. 253-259
    D. S. Wuu -PECVD SiOx 박막) [2005]
  • Ursula R.Kattner,"Phase Daigrams for Lead-Free Solder Alloys", JOM, Vol. 54, Issue 12, pp. 45-51, December 2002
  • Thin Film Encapsulation for OLEDs ; Evaluation of Multi-layer Barriers using the Ca test
    Bouten, P. Kuilder, M. Moro, L. Nisato, G. Philips, O. Rutherford, N. SID Symposium Difest of Technical Papers, 34(1), pp.550-553, [Ca test 투과도] [2003]
  • S. Logunov, S. Marjanovic and J. Balakrishnan, "Laser Assisted Frit Sealing for High Thermal Expansion Glasses.", JLMN-Journal of Laser Micro/Nanoengineering, Vol. 8, No. 3, pp. 326-333, 2012.
  • Ralf Dunkel, Roko Bujas, Andre Klein and Volker Homdt, " A new method for measuring ultra-low water-vapor permeation for OLED displays", Journal of the Society for Information Display, 12(7), pp. 569-573, 2005 (HTO)
  • Permeation rate measurements by electricla analysis of calcium corrosion
    A. Winnacker D. Henseler K. Heuser R. Paetzold V. Cesari Review of Scientific Instruments, 74(12), pp.5147-510, (Ca 전도도) [2003]
  • P. J. Holmes, "Handbook of thick film technology"
  • Long-lifetime thin-film encapsulated organic light-emitting diodes
    C. S. Lee F. L. Wong K. H. Kong M. K. Fung S. L. Lai S. L. Tao S. T. Lee W. M. Choy W. M. Tsang JOURNAL OF APPLIED PHYSICS, Vol. 104, pp. 014509-1, -박막 [2008]
  • L .S. Chang, R. H. Horng, C. L. Huang and Y. J. Gao, "Water oxygen permeation of silicon nitride films prepared by plasma-enhanced chemical vapor deposition", Surface & Coatings Technology 198, pp. 114-117
  • K Yamashita, T Mori and T Mizutani, "Encapsulation of organic light-emitting diode using thermal chemical-vapor-depositon polymer film", Journal of Physics D;Applied Physics
  • John Fahlteich, Stefan Mogck, Tomasz Wanski and Nicolas Schiller, "The roll of defect in single- and Multi-Layer Barriers for Flexible Electronics" , 57 th Annual Technical Conference Proceedings of the Society of Vacuum Coaters pp. 36-43, 2014
  • Jens Meyer, Patrick G rrn, Frnaz Bertram, Sami Hamwi, Thomas Winkler, Hans-Hermann Johannes, "Al2O3/ZrO2 nanolaminates as ultrahigh gas-diffusion barriers-a strategy fot reliable encapsulation of organic electronics, Advanced Materials, 20(18), pp.1845-1849, 2009 Al2O3/ZiO2
  • J. S. Park, H. C. Chae, H. K. Chung and S. I. Lee, "Thin film encapsulation for flexible AM-OLED: a review", Semicond. Sci. Technol., Vol. 26, pp. 034001, 2011.
  • J. K. Ham, J. W. Park and Y. M. Kim, "Thermal and barrier properties of liquid getter-filled encapsulations for OLEDs", Organic Electronics, Vol. 12, pp. 2174-2179, 2011.
  • J. A Bertrand, and S. M. George, "The roll of defect in single- and Multi-Layer Barriers for Flexible Electronics" , 54 th Annual Technical Conference Proceedings of the Society of Vacuum Coaters pp. 492-496
    (Ca 전도도) [2011]
  • Hui-ying Li, Yun-Fei Liu, Yu Duan, Yong-뺘뭏 Yang and Yi-Nau Lu, "Method for Aluminum Oxide Thin Films Prepared through Low Temperature Atomic Layer Deposition for Encapsulating Organic Electroluminescent Devices", Materials, 8, pp.600-610
    ALD Al(OH)3 [2015]
  • Heat transfer property of thin-film encapsulation for OLEDs
    Ham, H. Park, C. Park, J. Organic Electronics, Vol. 12, pp. 227-233, 박막 [2011]
  • H.S. Choi, H.K. Kwon, K.S. Kim, J.S, Park and C.H. Moon,"Separation Characteristics of an LMPA-Polymer Mixture for the Encapsulation of Organic Light-emitting Diode", IEEE Transactions on component, Packaging and manufacuring technology, 4,7, pp. 1131-1135, 2014.
  • H.-C. Langowski, "Flexible Barrier Materials for Technical Applications", 46 th Annual Technical Conference Proceedings of the Society of Vacuum Coaters pp. 559-565
    - 투습 레인지 [2003]
  • Gregory P. Crawford, "Flexible flat panel display", John Wiley & Sons, 2005 1
  • Evalution of gas permeation barrier properties using electrical measurements of calciu, degradation
    B. K. Ju H. N. Hwang I. S. Kim J. H. Choi J. W. Huh Y. M. Kim Y. W. Park Review of scientific instruments, 78(6), 064071, (Ca 전도도) [2007]
  • Encapsulation of organic light-emitting devices using a perfluorinated polymer
    A. J. Heeger G. Rowell J. Granstrom J. S. Moon J. S. Swensen J. Yune APPLIED PHYSICS LETTERS, Vol. 93, pp. , 2008.박막 [1933]
  • Connection method of terminal to flexible flat cable and termina
  • Ca test of Al2O3 gas diffusion barriers grown by atomic layer deposion on polymers
    M. D. Groner M. H. Reilly P. F. Carcia R. S. Lclean S. M. George Applied Physics Letters 89, 03, 2006 [Ca test 투과도] [1915]
  • C. W, Tang and A. VanSlyke, "Organic electroluminescent diodes", Applied Physics Letters, Vol. 51, pp.913-915, 1987.
  • Bo-Chy Wang and Rechard J Spontak, "Morphology and gas barrier properties of thin SiOx coatings on polycarbonate:Correlations with plasma-enhanced chemical vapor deposition conditions", Journal of Materials Research, 15(03), 704-717
    Ahmet Gun Erlat (PECVD로 SiOx 박막) [2000]
  • B. S. Yim, J. M. Kim, S. H. Jeon, S. H. Lee, J. H. Kim, J. G. Han, Y. S. Eom and Y. E. Shin, "Self-Organized Interconnection Process Using Solderable ACA(Anisotropic Conductive Adhesive)", Materials Transactions, Vol.50, No.7, pp.1684-1689, 2009.
  • B. I. Choi, H. S. Nham, S. B. Woo and J. C. Kim, "Ultralow Waer Vapor Permeation Measurement Using Tritium for OLED Displays", Journal of the Korean Physical Society, 53(4), pp.2179-2184, 2008 (HTO)
  • B. G. Aitken, P. S. Danielson, J. E. Dickinson, Jr., S. L. Lonunov, R. Morena, M. L. Powley, K. P. Reddy, J.F. Schroeder, Ⅲ and A. streltsov, "Hermetically sealed glass package and method of fabrication". US patent No. 8148179
  • A .B. Chwang, M. A. Rothman, S. Y. Mao, R. H. Hewitt, M. S. Weaver, J. A. Silvernail, K. Rajan, M. Hack and J. J. Brown, "Thin film encapsulated flexible organic electroluminescent displays", Applied Physics Letters, Vol. 83, Number 3, pp.413-415, 2003.