연구동향 분석
박사

Sn-3.0Ag-0.5Cu 솔더 연결부의 미세조직 및 기계적 물성치에 대한 시효처리 및 변형률 속도의 영향 = Effects of aging treatment and strain rate on mechanical properties and microstructure of Sn-3.0Ag-0.5Cu solder joints

렁 2015년

논문상세정보
인용/피인용
' Sn-3.0Ag-0.5Cu 솔더 연결부의 미세조직 및 기계적 물성치에 대한 시효처리 및 변형률 속도의 영향 = Effects of aging treatment and strain rate on mechanical properties and microstructure of Sn-3.0Ag-0.5Cu solder joints' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • activation energy
  • brittle fracture
  • fracture toughness
  • intermetallic compound (imc)
  • joint strength
  • lead-free solder joints
  • microstructures
  • nanoindentation tests
  • strain rate
  • thermal aging
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
176 0

0.0%

' Sn-3.0Ag-0.5Cu 솔더 연결부의 미세조직 및 기계적 물성치에 대한 시효처리 및 변형률 속도의 영향 = Effects of aging treatment and strain rate on mechanical properties and microstructure of Sn-3.0Ag-0.5Cu solder joints' 의 참고문헌

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