박사

UHD 영상전송을 위한 고속신호 무결성 인터페이스 전송선로 분석에 관한 연구 = A Study on the Transmission Line Analysis of High Speed Signal Integrity Interface for Ultra High Definition Video Transmission

손희배 2015년
논문상세정보
' UHD 영상전송을 위한 고속신호 무결성 인터페이스 전송선로 분석에 관한 연구 = A Study on the Transmission Line Analysis of High Speed Signal Integrity Interface for Ultra High Definition Video Transmission' 의 주제별 논문영향력
논문영향력 선정 방법
논문영향력 요약
주제
  • signal integrity
  • transmission line
  • uhd
동일주제 총논문수 논문피인용 총횟수 주제별 논문영향력의 평균
101 0

0.0%

' UHD 영상전송을 위한 고속신호 무결성 인터페이스 전송선로 분석에 관한 연구 = A Study on the Transmission Line Analysis of High Speed Signal Integrity Interface for Ultra High Definition Video Transmission' 의 참고문헌

  • Yen-Hui Lin and Tzong-Lin Wu, “Investigation of signal quality and radiated emission of microstrip line on imperfect ground plane: FDTD analysis and measurement,” IEEE International Symposium on Electromagnetic Compatibility, Vol. 1, pp. 319-324, Aug. 2001.
  • Y.-W. Kim, J.-H. Kim, H.-W. Yang, O.-K. Kwon, C. Ryu and B.-Y. Min, “A new via hole structure of MLB (multi-layered printed circuit board) for RF and high speed systems,” Electronic Components and Technology Conference, Proceedings, pp. 1378-1382, May 2005.
  • Y.-F. Han and Z. Yan, “The Simulation and Pre-design on the PCB of the Simulator,” 2008 APMC Electromagnetic Compatibility and 19th Int. Zurich Symp. on Electromagnetic, Singapore, pp. 871-874, May 2008.
  • Y. Shao, Z. Peng and J. F. Lee, “High speed interconnects of multi-layer PCB analysis by using non-conformal domain decomposition method,” Electromagnetic Compatibility (EMC), IEEE International Symposium, pp. 637-642, July 2010.
  • Y. Chen, Z. Chen, Z. Wu, D. Xue and J. Fang, “A new approach to signal integrity analysis of high-speed packaging,” Electrical Performance of Electronic Packaging, pp. 235-238, Oct. 1995.
  • X. Ying and Y. Zhaowen, “EMI and PI analysis of analog board,” 2013 IEEE 5th Int. Symp. MAPE, Chengdu, pp. 171-175, Oct. 2013.
  • W. Park and S.-C. Lee, “Design of LVDS driver based CMOS transmitter for a high speed serial link,” 2010 Int. Conf. on ICEIE, Kyoto, Aug. 2010.
  • W. Pan, D. Pommerenke, S. Xu and J. Jia, “PCB ground fill design guidelines for radiated EMI,” Electromagnetic Compatibility, IEEE International Symposium, pp. 1-6, Aug. 2008.
  • W. Li-Xin, Z. Yu-xia and Z. Gang, “Power Integrity Analysis for High-Speed PCB,” Pervasive Computing Signal Processing and Applications (PCSPA), First International Conference, pp. 414-418, Sept. 2010.
  • W. Jiwei and J. Weiping, “Signal-power integrity co-simulations of high speed systems via chip-package-PCB co-analysis methodology,” Electronic Packaging Technology (ICEPT), 14th International Conference, pp. 485-491, Aug. 2013.
  • Thine Electronics, “V-by-One HS Standard Version 1.4,” 2011.
  • T.-L. Wu, Y.-H. Lin, T.-K. Wang, C.-C. Wang and S.-T. Chen, “Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits,” Microwave Theory and Techniques, IEEE Transactions, Vol. 53, no. 9, pp. 2935-2942, Sept. 2005.
  • S.-L. Chung and W.-Y. Chen, “Design of Test Pattern Databank for Functional Testing of LCD Panels,” 2006 IEEE Int. Symp. on Industrial Electronics, Montreal, pp. 3002-3007, July 2006.
  • S. Shahparnia and O. M. Ramahi, “Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures,” Electromagnetic Compatibility, IEEE Transactions, Vol. 46, no. 4, pp. 80-587, Nov. 2004.
  • S. Hashino, S. Toshihisa, “Separation Measurement of Parasitic Impedance on a Power Electronics Circuit Board using TDR,” Energy Conversion Congress and Exposition(ECCE), pp. 2700-2705, Sept. 2010.
  • S. H. Hall and H. L. Heck, “Advanced signal integrity for high-speed digital designs,” John Wiley and Sons, 2011.
  • S. Connor, B. Archambeault, M. Mondal, “The Impact of Common Mode Currents on Signal Integrity and EMI in High-Speed Differential Data Links,” Electromagnetic Compatibillity, IEEE International Symposium on, pp. 1-5, Aug. 2012.
  • R. Inti, Wenjing Yin, A. Elshazly, N, SasidharandP. K. Hanumolu, “A 0.5 to 2.5Gb/s reference less half-rate digital CDR with unlimited frequency acquisition range and improved input duty-cycle error tolerance,” IEEE Solid-State Circuits Conference Digest of Technical Papers, pp. 438-439, Feb. 2011.
  • R. Goyal, “Managing signal integrity [PCB design],” Spectrum, IEEE Vol. 31, no. 3, pp. 54-58, Mar. 1994.
  • Q. Xiaofeng, W. Yushu, L. Shufang, Y. Chenguang and G. Yougang, “Simulation and analysis of via effects on high speed signal transmission on PCB,” Radio Science Conference, Proceedings Asia-Pacific, pp. 283-286, Aug. 2004.
  • M. P. James, N. Achutananda, K. N. Rao and T. S. Nanjundaswamy, “Design and evaluation of controlled impedance PCBs for high frequency applications,” ElectroMagnetic Interference and Compatibility (INCEMIC), Proceedings of the 9th International Conference, pp. 25-30, Feb. 2006.
  • M. M. Mechaik, “An evaluation of single-ended and differential impedance in PCBs,” Quality Electronic Design, International Symposium, pp. 301-306, Mar. 2001.
  • L.-X. Wang, Y.-X. Zhang, and G. Zhang, “Power Integrity Analysis for High-Speed PCB,” 2010 First Int. Conf. on PCSPA, Harbin, pp. 414-418, Sept. 2010.
  • L. Fu, Y. Han, and K. Wu, “ Signal integrity research for high-speed vedio system design based on HyperLynx simulation,” 2011 3rd ICCRD, Shanghai, pp. 15-18, Mar. 2011.
  • K.-H. Lee, S.-J. Kim, D.?K. Jeong, V. D. Costa, G.-D. Kim, and B. Kim, “High speed low EMI digital video interface with cable deskewing and transition minimization coding,” IEEE Int. Symp. on VLSI Circuits, pp. 33-34, June 1997.
  • K. S. D. Oh and X. C. C. Yuan, “High-Speed Signaling: Jitter Modeling, Analysis, and Budgeting,” Prentice Hall, 2011.
  • K. Mitani, M. Sugawara, H. Shimamoto, T. Yamashita, and F. Okano, “Ultrahigh-definition color video camera system with 8K 4K pixels,” 2008 Journal of Electronic Imaging, Vol. 17, no. 2, May 2008.
  • K. Kaneko and N. Ohta, “4K applications beyond digital cinema,” 2010 16th Int. Conf. on VSMM, Seoul, pp. 133-136, Oct. 2010.
  • K. Cho, S.-J. Lee, S.-M. Kim, and D.-H. Kim, “Display signal interface techniques for mobile applications,” 2011 3rd Asis Symp. on Quality Electronic Design, Kuala Lumpur, pp. 105-108, July 2011.
  • J. Xiaosong and Z. Runjing, “Crosstalk Analysis and Simulation in High-Speed PCB Design,” Electronic Measurement and Instruments, ICEMI'07, 8th International Conference, pp. 2-437, Aug. 2007.
  • J. Fan, X. Ye, J. Kim, B. Archambeault, and A. Orlandi, “Signal integrity design for high-speed digital circuits: Progress and directions,‖ IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 392–400, May 2010.
  • I. E. Opris and G. T. A. Kovacs, “ rail-to-rail ping-pong op-amp,” IEEE J. Solid State Circuits, Vol. 31, no. 9, pp. 1320-1324, Sept. 1996.
  • H.-K. Jeon, H.-R. Kim, J.-M. Choi, J.-P. Hong, Y.-S. Kim, H.-S. Oh, D.-K. Han, and L.-S. Kim, “High speed serial interface for mobile LCD driver IC,” 2008 ISCAS Circuits and Systems, Seattle, pp. 157-160, May 2008.
  • H. K. O. Berge and P. Hafliger, “High-speed serial AER on FPGA,” Circuits and Systems, ISCAS. IEEE International Symposium, pp. 857-860, May 2007.
  • H. J. Visser, “Equivalent length design equations for right-angled microstrip bends,” 2007 The Second European Conf. on Antennas and Propagation, Edinburgh, Nov. 2007.
  • H. B. Son, O. K. Kweon, “Analysis of Signal Integrity of High Speed Serial Interface for Ultra High Definition Video Pattern Control Signal Generator,” Korea society of Broadcast Engineers, Vol. 19, No. 5, pp. 726-735, Sept. 2014.
  • H. B. Son, J. H. Jin, Y. C. Rhee, “Analysis of Signal Distortion for Ultra High Definition Video Pattern Control,”J. of the Korea Institute of Electronic Communication Sciences, Vol. 9, No. 10, pp. 1197-1206, Sept. 2014.
  • G. Siew, T. T. Yan, C. Haoyang, S. Soh and K. J. Heon, “Effect of ground plane design for WLP with signal integrity modeling and analysis,” Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 1-4, Dec. 2010.
  • E.-M. Kim and G.M. McColgan, “Effects on return loss due to microstrip line radial bends and via density,” 2007 IEEE Antennas and Propagation Society Int. Symp., Honolulu, pp. 3101-3104, June 2007.
  • E. T. M. Shang, S. C. Lee, and P. Sebastian, “Signal Integrity Analysis for High Speed Digital Circuit,” Intelligent and Advanced Systems(ICIAS), International Conference on, pp. 1-6, June 2010.
  • DisplayPort Proposed Standard Version 1.0 Draft 1, Video Electronics Standards Association (VESA), Aug. 2005.
  • D. Xiaomin, R. Rimolo-Donadio, H. Bruns, and C. Schuster, “Fast and concurrent simulations for SI, PI, and EMI analysis of multilayer printed circuit boards,” 2010 AMEMC, Beijing, pp. 614-617, Apr. 2010.
  • D. Johnson, “An FPGA-based solution for testing legacy video displays,” 2010 IEEE AUTOTESTCON, Orlando, Sept. 2010.
  • D. H. Kim, S. J. Lee, S. M. Kim, and K. Cho, “Display signal interface techniques for mobile applications,” Quality Electronic Design (ASQED), 2011 3rd Asia Symposium, pp. 105-108, July 2011.
  • D. Chowdhury, B. Goswami and R. Mantri, “Analysis of differential termination technique in cascading of high speed LVDS signals on a PCB,” India Annual Conference, Proceedings of the IEEE INDICON, pp. 557-560, Dec. 2004.
  • C. Enz, E. Vittoz, F. Krummenacher, “CMOS chopper amplifier,” IEEE J. Solid-State Circuits, Vol. 22, no. 3, pp. 335-342, June 1987.
  • C. C. Chen, J. L. Dong, Y. T. Chang, C. K. Chen and C. W. Hsue, “A study of PCB EMI measurement and simulation,” Asia-Pacific International Symposium on Electromagnetic Compatibility, pp. 736-739, Apr. 2010.
  • B.-G. Kang, H. Kim and J.-G. Yook, “Optimization of via structure in multilayer PCB for high speed signal transmission,” Electrical Design of Advanced Packaging and Systems Symposium, pp. 105-108, Dec. 2008.
  • B. Xu, S. Tang, Y. Chen and T. McDonough, “Analysis and optimization of differential PCB traces,” Antennas and Propagation Society International Symposium, APSURSI. IEEE, pp. 1-4, June 2009.
  • B. Wong, A. Cantoni, and Antonio, “Radiated emissions and signal integrity of printed circuit board microstrip,” in 2010 IEEE Symp. Electromagn. Compat., Melbourne, VIC, pp. 1-6, Sept. 2010.
  • B. T. Reyes, G. Paulina, L. Tealdi, E. Labat, R. Sanchez, P. S. Mandolesi and M. R. Hueda, “A 1.6 Gb/s CMOS LVDS transmitter with a programmable pre-emphasis system,” Circuits and Systems (LASCAS), IEEE 5th Latin American Symposium, pp. 1-4, Feb. 2014.
  • B. Razavi, “Challenges in the design of high-speed clock data recovery circuit,” IEEE Communication Magazine, pp. 94-101, Aug. 2002.
  • B. A. Beault, J. C. Diepenbrock, and S. Connor, “EMI emissions from mismatches in high speed differential signal traces and cables,” in 2007 IEEE Int. Symp. Electromagn. Compat., Honolulu, HI, pp. 1-6, July 2007.
  • A. Weisshaar, S. Luo, M. Thorburn, V.k Tripathi, M. Goldfarb, J.L. Lee, and E. Reese, “Modeling of radial microstrip bends,” 1990 IEEE MTT-S Int. Microwave Symp. Digest, Dallas, Vol. 3, pp. 1051-1054, May 1990.
  • A. Lingambudi, G. Edlund, A. Haridass, and D. Becker, “A case study of high-speed serial interface simulation with IBIS-AMI models,” 2012 IEEE Electrical Design of Advanced Packaging and System Symp., Taipei, pp. 145-148, Dec. 2012.
  • A. Brandl, E. Recht, and V. Bar-Natan, “LVDS signal integrity for video transmission lines,” 2003 IEEE Int. Symp. on Electromagnetic Compatibility, Vol. 1, Istanbul, pp. 537-538, May 2003.
  • A. B. Menicanin, M. S. Damnjanovic and L. D. Zivanov, “Parameters Extraction of Ferrite EMI Suppressors for PCB Applications Using Microstrip Test Fixture,” Magnetics, IEEE Transactions on Vol. 46, no. 6, pp. 1370-1373, June 2010.
  • A. Amedeo, C. Gautier, F. Costa, L. Bermard, “Signal Integrity Ensured Throuhg Impedance Characterization of Advanced High-Speed Design,” Electromagnetic Compatibillty, 20th International Zurich Symposium on, IEEE, pp. 249-252, Jan. 2009.