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The Dry Etching Characteristics of TiO2 Thin Films in N2/CF4/Ar Plasma
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Choi, Kyung-Rok
Woo, Jong-Chang
Kim, Chang-Il
Joo, Young-Hee
Chun, Yoon-Soo
한국전기전자재료학회[2014]
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The Fabrication of an Applicative Device for Trench Width and Depth Using Inductively Coupled Plasma and the Bulk Silicon Etching Process
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Choi, Chang-Auck
Woo, Jong-Chang
Kim, Chang-Il
한국전기전자재료학회[2014]
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Dry Etching Properties of HfAlO3 Thin Film with Addition O2 gas Using a High Density Plasma
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Kim, Jeong-Ho
Woo, Jong-Chang
Lee, Yong-Bong
한국전기전자재료학회[2014]
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Chemical Reaction on Etched TaNO Thin Film as O2 Content Varies in CF4/Ar Gas Mixing Plasma
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Kim, Chang-Il
Woo, Jong-Chang
한국전기전자재료학회[2017]
Google Scholar네이버 전문정보
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