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Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs
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Lim, Sung Kyu
Yu, Yun Seop
Samal, Sandeep
Panth, Shreepad
한국정보통신학회[2014]
Google Scholar네이버 전문정보
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Research Needs for TSV-Based 3D IC Architectural Floorplanning
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Lim, Sung Kyu
한국정보통신학회[2014]
Google Scholar네이버 전문정보
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Die-to-Die Parasitic Extraction Targeting Face-to-Face Bonded 3D ICs
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Lim, Sung Kyu
Song, Taigon
한국정보통신학회[2015]
Google Scholar네이버 전문정보
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Full-Chip Power/Performance Benefits of Carbon Nanotube-Based Circuits
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Lim, Sung Kyu
Song, Taigon
한국정보통신학회[2015]
Google Scholar네이버 전문정보
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